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Offset placement after soldering system

The offset placement after soldering system checks the solder paste position related to the pad location. Components are placed centered on the solder paste print instead of the pads which increases dramatically the process accuracy specially for very small component placement.



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Latest News
 

Juki at SMT Hybrid Packaging 2013

Trevor Galbraith interviews Jürg Schüpbach, President Juki Automation Systems Europe, at SMT Hybrid Packaging in Nuremberg.

For the first time, Juki offers a total line solution

To cope with the always changing customer and market requirements, Juki now sells complete line solutions since the beginning of 2013.

ISM – Intelligent Storage Management –
Juki’s new, high-capacity and intelligent storage systems



The ISM from Juki with intelligent link to the SMT assembly machine optimizes dramatically the material flow and the inventory and thereby lowers the production costs.

The new reflow ovens JUKI RS800, RS800N, JUKI RS1000, RS1000N achieve the highest technical requirements and this with an extraordinary price performance ratio



JUKI’s “RS-Reflow Soldering” enables an excellent soldering quality for a really fair price.